Access to the system is strictly conditioned to:

  • Prior validated training
  • Mandatory reading and understanding of protocols
  • Authorization by responsible laboratory personal.

General System Operation

Complementary Surface Characterization

Vacuum and UHV Conditions

Sources and Deposition

  • SPM and Nanonis electronics power on/off
  • Initial system status verification (vacuum, electronics, communications)
  • Software and controller initialization
  • RGA (Residual Gas Analysis)
  • Low-Energy Electron Diffraction (LEED)
  • Auger Electron Spectroscopy (AES)
  • Quartz Crystal Microbalance (QCM)
  • Start pumping / pump-down
  • Bake-out (preparation, execution, cooldown)
  • Controlled venting (N₂)
  • System degassing
  • Leak checking and valve/interlock operation
  • Evaporators
  • Kim evaporator
  • 4×OMBE source
  • Power supply (Fug)
  • Thermocouples

Sample Handling and Transfer

Electronics and Control (Nanonis)

Sample Preparation

Critical Components and Instrumentation

  • Load-lock loading/unloading
  • Inter-chamber transfer:
  • load-lock → preparation → analysis
  • Use of manipulators (transfer rods, wobble stick)
  • UHV suitcase transfers (currently in preparation)
  • Module configuration: RC4, SC4, OC4, HVS4, HVA4, AKAH
  • Communication verification:
  • usb, ethernet, analog signals

  • Channel configuration and data acquisition
  • Associated protocols: electrical maintenance, LabView2016
  • Ion sputtering (Ar⁺) - annealing cycles
  • Tip sputtering / tip cleaning
  • Heating (e-beam: Kentax)
  • Gas dosing (leak valve) Sample handling procedures

  • Ion source filament
  • Kolibri sensor replacement
  • Heater filaments (tungsten thorium)
  • Maintenance: Scroll and turbomolecular pumps.
  • Spot welding

SPM Operation (STM / nc-AFM)

System Maintenance

Spectroscopy and Local Characterization

Operational Safety

  • Tip approach and retraction (coarse motor)
  • Feedback parameter tuning (PID)
  • Bias, current, and Δf configuration
  • Amplitude calibration
  • Scanning and image acquisition
  • Associated protocols: scanning nc-AFM/STM, amplitude calibration
  • Topographic calibration of XYZ piezo scanners
  • Component degassing
  • Tip cleaning (sputtering)
  • Inspection of electrical and vacuum connections
  • Cleaning of sample holders
  • Alumina crucible replacement in the OMBE source
  • Degassing of molecular compounds
  • Optimization of sputtering-annealing parameters and spatial alignment
  • Bias spectroscopy
  • I–V measurements (IVs)
  • Z-spectroscopy (I–z, Δf–z)
  • Grid / mapping spectroscopy

  • Mandatory PPE (gloves, goggles, thermal protection)
  • Safe handling of high voltage systems (Fug, e-beam)
  • Emergency procedures (vacuum, electrical, thermal events)